See the defect field, not just the defect.
Visible-light metrology for diamond substrates - mapping dislocation loci, surface variation, bending, roughness, stress signatures, and 3D topography from whole-wafer scale to a 20 micron field of view.
Built on tens of thousands of diamond defects.
From 2023 through 2026, NanoFraction developed this use case with GLCT using diamond wafer data across macro, micro, and nanoscale views. The resulting analytical pipeline was trained to identify patterns in defect geometry and gradient signatures.
The objective is practical: screen more of the wafer rapidly, localize regions that require attention, and use higher-cost methods where they add the most value.
Measured outputs from one optical workflow.
NanoFraction combines real-time image capture with gradient analysis and AI-assisted interpretation to locate dislocation signatures and characterize the surrounding field.
Reported figures are research results from the GLCT collaboration dataset and should be validated against each customer's material, process, and reference method.
Map the locus and its surrounding stress signature.
Each feature exists within a wider field of tension, compression, topography, and surface variation. The NanoFraction pipeline is designed to preserve that context rather than reducing inspection to a binary defect marker.
- Defect location
- Type and geometry
- Local and global fields
- Whole-wafer bending
- Surface roughness
- 3D topography
Use high-cost tools where they matter most.
NanoFraction is designed as a screening and decision layer that can reduce unnecessary measurement cycles while directing confirmatory analysis toward the most informative locations.
Capture
Acquire whole-wafer and targeted optical views without destructive preparation.
Map
Generate defect, gradient, stress-signature, roughness, and topography outputs.
Prioritize
Identify the locations and signatures that warrant deeper investigation.
Confirm
Correlate selected regions with etch-pit, birefringence, cathodoluminescence, SEM, or other reference methods.
From image to actionable defect map.
The analytical pipeline detects candidate loci, measures relationships among features, and groups defects according to gradient signature. Outputs can be adapted to a customer's wafer geometry, process history, and existing inspection criteria.
A/B test NanoFraction against your current diamond inspection process.
Define one high-value defect-detection question, compare outputs with your present workflow, and measure whether NanoFraction improves coverage, cycle time, or the selection of locations for confirmatory analysis.